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33
This
product
has
not
been
designed
or
tested
for
use
in,
and
is
not
intended
for
use
in,
applications
implanted
into
the
human
body
nor
in
applications
in
which
failure
of
the
product
could
lead
to
death,
personal
injury
or
property
damage,
including
but
not
limited
to
equipment
used
in
the
operation
of
nuclear
facilities,
life-support
machines,
cardiac
defbrillators
or
similar
emergency
medical
equipment,
aircraft
navigation
or
communication
or
control
systems,
air
traffc
control
systems,
or
weapons
systems.
Copyright
?
2010
Cree,
Inc.
All
rights
reserved.
The
information
in
this
document
is
subject
to
change
without
notice.
Cree
and
the
Cree
logo
are
registered
trademarks
and
Z-Rec
is
a
trademark
of
Cree,
Inc.
CPW3-1700S025 Rev. -
Cree,
Inc.
4600
Silicon
Drive
Durham,
NC
27703
USA
Tel:
+1.919.313.5300
Fax:
+1.919.313.5451
www.cree.com/power
Chip Dimensions
Part Number
Anode
Cathode
Package
Marking
CPW3-1700S025B
Al
Ni/Ag
Sawn
on
Foil
Wafer
#
on
Foil
The
die-on-tape
method
of
delivering
these
SiC
die
may
be
considered
a
means
of
temporary
storage
only.
Due
to
an
increase
in
adhesion
over
time
die
stored
for
an
extended
period
may
affx
too
strongly
to
the
tape.
These
die
should
be
stored
in
a
temperature-controlled
nitrogen
dry
box
soon
after
receipt.
Cree
will
further
recommend
that
all
die
be
removed
from
tape
to
a
waffe
pack,
to
a
similar
storage
medium,
or
used
in
production
within
2
–
3
weeks
of
delivery
to
assure
100%
release
of
all
die
without
issues.
Symbol
Dimension
mm inch
A
5.70
0.224
B
3.94
0.155
C
4.4
0.173
D
2.6
0.102
5.70
4.4
D
2.6
3.94
B
A
C
Mechanical Parameters
Parameter
Typ.
Unit
Die
Size
5.70
X
3.94
mm
Anode
Pad
Size
5.1 X 3.3
mm
Anode
Pad
Opening
4.4
X
2.6
mm
Thickness
387
±
10%
μm
Anode
Metalization
(Al)
4
μm
Cathode
Metalization
(Ni/Ag)
1.8
μm
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